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    1. EN

      嵌入式存儲芯片


      全系列產(chǎn)品適配各類(lèi)應用場(chǎng)景

      高速大容量的移動(dòng)存儲解決方案

      • Nand Flash

        Memory chips supporting multiple wafers

        Follow JEDEC JESD230C international standard, standard package 132/252-ball BGA, support 32GB~1TB capacity segment, and support the original mainstream wafer. It can package 1-16 wafers in one particle. Products are divided into single channel, double channels and four channels. Single channel and dual channel Nand is suitable for U disk and SSD; Four-channel Nand is suitable for M.2 2230 SSD product.


        Solid State Drive

        SSD

        Data center

        USB Flash Drives

        系統盤(pán)

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